I-Low Temperature Co{0}}i-Ceramic ecishiwe
Incazelo
I-Parameters yobuchwepheshe
I-Low Temperature Co-I-Fired Ceramic Technology isho inqubo yokubhoboza izimbobo ngokuzenzakalelayo, ukuzigcwalisa nge-conductor paste, ukuphrinta, ukupakisha, nezinye izinqubo ezisetshenziselwa ukukhiqiza izingxenye ze-elekthronikhi ezidingekayo kusuka kumapheshana e-ceramic eluhlaza. Njengobuchwepheshe obuphambili-, i-LTCC inemakethe yezicelo ebanzi kakhulu kanye namathuba abalulekile okuthuthukiswa kwesikhathi esizayo. Isetshenziswa kakhulu emikhakheni ehlukahlukene, njengesayensi yamakhompiyutha, imboni yezimoto, umkhakha wezokwelapha kanye ne-aerospace.



Isiqondiso Socwaningo
Isiqondiso sokuthuthukiswa kwe-LTCC ukwakha izinhlobo ezintsha zezinhlelo ze-ceramic tape ezinezindleko eziphansi, ukusebenza okuphezulu nokunemba. Lawa masistimu e-ceramic tape anika amandla ukukhiqiza izisetshenziswa zikagesi ezinokuxuba okuphezulu nokuphansi-kokuhlanganisa imvamisa, izimbotshana eziyinkimbinkimbi,{2}}ukuhlanganiswa okuphezulu, kanye ne-miniaturization.



Inqubo Yezobuchwepheshe
Ukushaya → Ukugcwalisa → Ukuphrinta → Ukupakisha → Ukucindezela → Ukusika Okushisayo → I-Co-Ixoshiwe → I-Scribing→Ukuhlola
Isingeniso somkhiqizo
1,Izinto Zokuhlola: Ukubukeka
Amathuluzi Okuhlola: I-Stereomicroscope
Izindlela Zokuhlola: Indlela ye-GJB548B 2032
I-Technical Index: ama-80% ezingxenye zezithombe aphelele
2,Izinto Zokuhlola:Ubukhulu Sebonke
Amathuluzi Okuhlola:I-Vernier Caliper, Ithuluzi Lokulinganisa Isithombe
Izindlela Zokuhlola:GJB548B,Indlela ka-2016
Inkomba Yezobuchwepheshe:
| Into | Iphutha |
| Ubukhulu | ±0.2 mm |
| I-Warpage | Yiba ngaphezu kuka-3% |
| I-Cavity | ±0.1 mm |
3,Izinto Zokuhlola: Ukunamathela Kwe-Membrane
Amathuluzi Okuhlola: I-3M610 Adhesive Tape
Izindlela Zokuhlola: Indlela Yokuhlola I-ASTM B571-97
I-Technical Index : Ngaphansi kwesibonakhulu esingu-40X, ayikho into exebukayo kulwelwesi lwanoma yiluphi uhlobo.
4,Izinto Zokuhlola:Ukumelana Nokushisa Okuphezulu Kwesendlalelo Se-Membrane
Amathuluzi Okuhlola: Isiteji Esishisayo
Izindlela Zokuhlola: Gcina ku-400℃imizuzu eyi-10
I-Technical Index:Ngaphansi kwesibonakhulu esingu-40X, akukho ukushintsha kombala, ukuxebuka, amabhamuza, noma ukuxebuka kwesenzakalo kulwelwesi lwanoma yiluphi uhlobo.
5, Ezinye Izinkomba Zezobuchwepheshe
| Into | Inkomba Yezobuchwepheshe |
|
Nge-Hole Diameter |
0.2 mm, 0.15 mm |
|
Ukunemba Kwesikhundla Sokushaya |
±10 µm |
| Ukunemba Kwesitaki | ±10 µm |
|
Ukuphrinta Ububanzi Bolayini We-Thinnest |
75 µm |
|
Ukunemba kokuqina kwefilimu |
±2 µm |
| Amandla Ebhondi |
>3 g(25 µm Ubude bentambo yegolide) |
| Ifilimu Adhesion | >0.5 kg/mm2 |
| Inombolo Yezendlalelo | 5-30 Izendlalelo |
Isikhungo se-Microcircuit
I-Microcircuit Centre yasungulwa ngo-2022, inocwaningo oluzimele nemisebenzi yokubambisana yangaphandle. Ochwepheshe bemboni bahola ithimba ukuthi libe nesibopho socwaningo lwezobuchwepheshe oluhlobene nomsebenzi wokuthuthukisa. Umnyango unendawo yokuhlanza engamamitha-skwele angu-1500 kanye nethimba locwaningo nokuthuthukiswa kwezobuchwepheshe labantu abangaphezu kweshumi, elinamakhono{4}}ahamba phambili embonini. Isikhungo se-microcircuit sakhiwe nge-LTCC (Low Temperature Co fired Ceramic) ulayini wokukhiqiza we-Ceramic, ukubhoboza, ukuphrinta, ukufakwa kwe-laminating, ukufakwa kwe-laminating, ukudubula ngokubambisana, ukusika kanye neminye imisebenzi ehlobene. Ngasikhathi sinye, kukhona nomugqa omncane wokukhiqiza ifilimu onezinqubo eziphelele ezifana ne-sputtering, i-photolithography, ne-electroplating, engenza imikhiqizo evamile yesekethe yefilimu emincane kanye nemikhiqizo ye-DPC.
Amashadi ashisayo: izinga lokushisa eliphansi-i-ceramic evuthayo, izinga lokushisa eliphansi lase-China-abakhiqizi be-ceramic abacishiwe, abahlinzeki, imboni
Ngaphambilini
Akukho UlwaziOkulandelayo2
I-Thin Film Circuit TechnologyThumela ukuPhenya











